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FABRICATION NOTES (UNLESS OTHERWISE SPECIFIED)
1) FABRICATE PER IPC-6012A CLASS 2.
2) OUTLINE DEFINED IN SEPARATE GERBER FILE WITH
"Edge_Cuts.GBR" SUFFIX.
3) SEE SEPARATE DRILL FILES WITH ".DRL" SUFFIX
FOR HOLE LOCATIONS.
SELECTED HOLE LOCATIONS SHOWN ON THIS DRAWING
FOR REFERENCE ONLY.
4) SURFACE FINISH: ${pcb_finish_cap}
5) SOLDERMASK ON BOTH SIDES OF THE BOARD SHALL
BE LPI, COLOR ${solder_mask_color_text_cap}.
6) SILK SCREEN LEGEND TO BE APPLIED PER LAYER
STACKUP USING ${silk_screen_color_text_cap} NON-CONDUCTIVE EPOXY INK.
7) ALL VIAS ARE TENTED ON BOTH SIDES UNLESS
SOLDERMASK OPENED IN GERBER.
8) RESERVED
9) PCB MATERIAL REQUIREMENTS:
A. FLAMMABILITY RATING MUST MEET OR EXCEED
UL94V-0 REQUIREMENTS.
B. Tg 135 C OR EQUIVALENT.
10) DESIGN GEOMETRY MINIMUM FEATURE SIZES:
BOARD SIZE ${bb_w_mm} × ${bb_h_mm} mm
BOARD THICKNESS ${thickness_mm} mm
TRACE WIDTH ${track_mm} mm
TRACE TO TRACE ${clearance_mm} mm
MIN. HOLE (PTH) ${drill_pth_real_mm} mm
MIN. HOLE (NPTH) ${drill_npth_real_mm} mm
ANNULAR RING ${oar_mm} mm
COPPER TO HOLE ${c2h_mm} mm
COPPER TO EDGE ${c2e_mm} mm
HOLE TO HOLE ${h2h_mm} mm
#?stackup and impedance_controlled
#?stackup and impedance_controlled
11) REFER TO IMPEDANCE TABLE FOR IMPEDANCE CONTROL REQUIREMENTS.
#?stackup and impedance_controlled
#?stackup and impedance_controlled
12) CONFIRM SPACE WIDTHS AND SPACINGS.